This session will focus on new and advanced technologies for printed circuit board raw materials. The move toward smooth copper and low loss dielectric materials for improved signal integrity will be discussed. Darren will cover advances in PCB materials relative to high reliability, high density, as well as the latest changes coming for industry raw materials specifications. He will also cover trends in the industry related to coplanarity, solder joint reliability, signal integrity, and reliability as well as their impact on raw material properties and PCB fabrication.
