This session will focus on new and advanced technologies for printed circuit board and flexible circuit raw materials. The move toward smooth copper and low loss dielectric materials for improved signal integrity will be discussed. New material properties are impacted by trends in the industry including AI and networking data rates, and packaging technology (like glass core, larger packages, etc.). Darren will cover advances in PCB materials relative to high reliability, high density, as well as the latest changes coming for industry raw materials specifications. He will also cover trends in the industry related to coplanarity, solder joint reliability, signal integrity, and reliability as well as their impact on raw material properties and PCB fabrication.