Installing mechanical components via Surface Mount processes is gaining in popularity due to the speed (to be read low-cost) and efficiency of SMT lines. What isn’t often considered are the myriad of variables that can affect thruput, the final position of components and the strength of solder or pad adhesion. The goal of this presentation is to forearm designers with the knowledge of process limitations, potential failure modes and the tricks and tools that can help reduce the number of iterative design changes required to deliver on their dream.